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Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan

Metadata Updated: March 14, 2025

The data are associated with figures in R. Tao, S. P. Phansalkar, A. M. Forster, B. Han, Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked Second Reaction, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, Florida, May 30 - June 2, 2023. https://doi.org/10.1109/ECTC51909.2023.00225

Access & Use Information

Public: This dataset is intended for public access and use. License: See this page for license information.

Downloads & Resources

References

https://doi.org/10.1109/ECTC51909.2023.00225

Dates

Metadata Created Date March 18, 2023
Metadata Updated Date March 14, 2025

Metadata Source

Harvested from NIST

Additional Metadata

Resource Type Dataset
Metadata Created Date March 18, 2023
Metadata Updated Date March 14, 2025
Publisher National Institute of Standards and Technology
Maintainer
Identifier ark:/88434/mds2-2948
Data First Published 2023-03-10
Language en
Data Last Modified 2023-03-01 00:00:00
Category Chemistry:Thermochemical properties, Chemistry:Analytical chemistry, Chemistry:Chemical engineering and processing, Materials:Polymers, Materials:Composites, Materials:Materials characterization
Public Access Level public
Bureau Code 006:55
Metadata Context https://project-open-data.cio.gov/v1.1/schema/data.json
Schema Version https://project-open-data.cio.gov/v1.1/schema
Catalog Describedby https://project-open-data.cio.gov/v1.1/schema/catalog.json
Harvest Object Id ab3ca79b-1728-4de4-9580-48423d566278
Harvest Source Id 74e175d9-66b3-4323-ac98-e2a90eeb93c0
Harvest Source Title NIST
Homepage URL https://data.nist.gov/od/id/mds2-2948
License https://www.nist.gov/open/license
Program Code 006:045
Related Documents https://doi.org/10.1109/ECTC51909.2023.00225
Source Datajson Identifier True
Source Hash 2833d9f8a40f798706754f3e947ece24bdc5692ca3642b8767881d4555980743
Source Schema Version 1.1

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